Chemistry Unit 2
- Created by: Suhaib98
- Created on: 06-04-15 21:10
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- Chemistry
- Structure and Bonding
- Covalent Bonding (Non Metal + Non Metal)
- Strong Bonds High Melting Point,High Boiling Point
- Weak Bonds Low Melting Point,Low Boiling Point, No Electrical Charge
- Ionic Bonding (Metal + Non Metal)
- Strong Bonds High Melting Point, High Boiling Point
- Weak Bonds Low Melting Point, Low Boiling Point, Conducts Electricity At A Liquid State
- Metallic Bonding
- When the metal atoms are packed together the outer electrons delocalise allowing it to strongly attract the positive ions
- Covalent Bonding (Non Metal + Non Metal)
- Structure and Properties
- Diamonds
- High Melting Points, Not a Conductor of electricity, extremely hard
- Used for gemstone,dental drills and scalpals
- Graphite
- High Melting Point, High Boiling Point, 1 Delocalised electrons
- Diamonds
- Rates and Energy
- The gradient of the slope of the line shows us the speed increase
- Particles collide with a certain amount of energy before they can react
- An activation energy is required to start a chemical reaction
- Factors Which Affect Or Increase The Chance Of Reaction
- Temperature, Concentration Of Solutions, Pressure Of Gasses, Surface Area Of Solids,Using a Catalyst
- Catalyst speeds up the rate of reaction without being used up
- Different catalyst are needed for different reactions
- Increase the rate of reaction and reduce energy costs
- Different catalyst are needed for different reactions
- Salt and Electrolysis
- Structure and Bonding
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